Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete.

The partially protected wafer is immersed in a chemical solution that etches the unprotected wafer surface during the process. The most common etching agents include corrosive leeches, liquid solvents, and acids. Besides having high etch rates, wet etching also achieves high selectivity due to the simplicity of its equipment.

2020年10月21日 · 工廠中矽片（wafer）的製造過程可分哪幾個工藝過程(module)？ 答：主要有四個部分：DIFF（擴散）、TF(薄膜)、PHOTO（光刻）、ETCH（刻蝕）。 其中DIFF又包括FURNACE(爐管)、WET(濕刻)、IMP(離子 注入)、RTP(快速熱處理)。

何谓蚀刻(Etch)? 答：将形成在wafer表面上的薄膜全部，或特定处所去除至必要厚度的制程。 蚀刻种类: 答：(1)干蚀刻(2)湿蚀刻 蚀刻对象依薄膜种类可分为: 答：poly,oxide,metal 半导体中一般金属导线材质为何?

Silicon is the most common substrate material used in microelectronics and micro-mechanics. It is used not only as a passive substrate, but also as an active material in electronic or mechanical components. The neces-sary patterning can also be achieved by means of wet-chemical etching methods, as described in this chapter.

Silicon wafer etching processes are used for removing oxide layers from silicon micro-electronic devices. They are generally acidic and involve the exposure of a sample to the etching solution. The final product consists of a thin film of silicon nitride.

2025年3月4日 · 物理蚀刻主要是用plasma轰击wafer表面，粒子与粒子之间发生碰撞，达到蚀刻的目的，整个过程全部是物理变化，没有新的物质生成。 物理蚀刻是各向异性的，蚀刻方向沿着plasma速度方向，其他方向基本没有蚀刻，物理蚀刻没有选择性，高能离子可能会损伤器件。

Etching processes can be done on silicon and gallium arsenide (GaAs) and with metals that include aluminum, copper, and gold. Modutek provides wet bench technology and equipment to support a wide variety of wafer etching applications.

蝕刻製程乃是將經過微影製程在表面定義出IC電路圖案的晶圓,以化學腐蝕反應的方式,或物理撞擊的方式,或上述兩種方式的合成效果,去除部份材質,留下IC電路結構。 蝕刻技術主要分成兩大類:濕式蝕刻法與乾式蝕刻法。 Rate of material removal (μm/min) Function of concentration, mixing, temperature, ... 25 比1, 如果三分鐘後停止蝕刻, 試問會有多少下層的Si 被蝕刻掉? SLOWEST Dominates!!! Slowest Step Dominates (What if each is slowest?) 濕式蝕刻法利用化學溶液腐蝕 …

The etch process removes selected areas from the surface of the wafer so that other materials may be deposited. “Dry” etching is used for circuit-defining steps; “wet” etching (using chemical baths) is used mainly to clean wafers. Applied also offers an innovative “dry” removal process that selectively removes layers without using ...