bergquist® bond ply tbp 1400lms-hd是一款导热、可进行加热固化的层压材料。 该产品由一种高性能、导热、低模量的硅胶化合物组成，它被涂覆在固化芯材上，并配有双层保护膜。

With a low modulus, silicone-based BERGQUIST BOND-PLY LMS-HD effectively absorbs mechanical stresses common with assembly-level coefficient of thermal expansion (CTE) mismatches, and also provides robust protection against shock and vibration.

BERGQUIST® BOND PLY TBP 1400LMS-HD is a highly durable laminate material, which is heat curable and eliminates the need for mechanical fasteners. The high performance, flexible silicone design provides exceptional thermal range and effectively absorbs vibrations and other mechanical stresses caused by the assembly process.

加利福尼亞州歐文市 – 漢高開發了新型、加厚的bergquist ® bond-ply® lms-hd導熱材料。最新的bergquist bond-ply lms-hd是0.018厚導熱膠帶，符合美國保險業實驗室（ul）有關增加絕緣的標準和iec ii級絕緣標準。

Bond-Ply LMS-HD is a thermally conductive heat curable laminating adhesive. The product consists of a high performance thermally con-ductive low modulus silicone compound coated on a fiberglass weave,and double lined with protective films.The low modulus silicone design effectively absorbs mechanical stresses induced

Mouser offers inventory, pricing, & datasheets for Bergquist Company LMS-HD / TBP 1400LMS-HD Series Thermal Interface Products.

漢高開發了新一代更高厚度版本的 BERGQUIST BOND-PLY LMS-HD 導熱層壓材料。 新品亮點搶先看 擁有0.018”厚度的熱黏合劑 符合Underwriter’s Laboratories (UL)對強化絕緣體的標準 符合IEC Class II絕緣標準. 更嚴格標準打造

BERGQUIST BOND PLY TBP 1400LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films. The low modulus silicone design effectively absorbs mechanical stresses induced by assembly ...

Bond-Ply LMS-HD导热 热固性层压材料。 产品 由高性能热 导电低模量有机硅化合物 涂层在固化的核心，双内衬 保护膜。 低模量硅酮 设计有效吸收机械应力 装配水平的CTE失配引起的冲击和振动， 同时提供卓越的 热性能（与PSA技术）和 长期诚信。

低模量硅酮 设计有效吸收机械应力 装配水平的CTE失配引起的冲击和振动， 同时提供卓越的 热性能（与PSA技术）和 长期诚信。 Bond-Ply LMS-HD将 通常被用于结构动力 秉承 组件和印刷电路板的散热片。