Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.

Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer.

In this paper, wafer level packaging technologies including fan-in, fan-out WLPs, and 3-D integration are reviewed. A variety of fan-in WLP technologies, such as ball on nitride (or ball on I/O), ball on polymer, and copper post WLPs, are described. The solder ball reliability and thin film/redistribution copper trace failures under various ...

Fan-Out Wafer-Level Package (FO-WLP) is an enhancement of standard WLPs, enabling a greater number of I/O connections. This package involves dicing chips from a silicon wafer, precisely positioning the known-good- die on a “reconstituted” or “carrier” wafer / …

2023年12月8日 · Fan-out packaging is a design method where the connections (or I/Os - input/outputs) fan out from the die or chip, expanding beyond its periphery. This contrasts traditional fan-in designs, where connections are confined within the die area.

2021年6月17日 · Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and smartphones. In just one example of fan-out, a DRAM die is stacked on a logic chip in a package.

2021年10月6日 · SE: Fan-out is an advanced package type used by Apple and others to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and smartphones. Where does fan-out packaging fit today, and where is it going?

Fan-out packaging was developed to relax this limitation. It provides a smaller package footprint along with improved thermal and electrical performance compared to conventional packages and allows an increased number of contacts without increasing the die size.

2022年8月18日 · Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate.

Fan-out allows for standard packaging pitches independent of the die surface, enabling thinner packages. Currently, FC-CSP/FC-BGA are the most standard packages competing with fan-out. However, their cost is increasing fast with I/O density,mainly due to advanced substrate cost.