CoWoS ®-R (Chip on Wafer on Substrate with silicon interposer with fan-out RDL interposer) is a member of CoWoS ® advanced packaging family that leverages a redistribution layer (RDL) interposer as the interconnect between System on Chip (SoC) and/or high bandwidth memory (HBM) to achieve heterogeneous integration. An RDL interposer is ...

2025年3月10日 · 台積電的CoWoS先進封裝技術共有3種類型：CoWoS-S、CoWoS-R、CoWoS-L，主要差別在於中介層使用的材料，而在封裝結構及應用場景也各有不同。 CoWoS-S是台積電最早推出的CoWoS技術，採用矽中介層（silicon interposer）作為晶片與基板之間的連接橋樑，也是目前生產中的CoWoS最大宗的類型。 包括AI伺服器晶片、高效能運算（HPC）產品，如輝 …

2024年8月8日 · What is CoWoS-R? CoWoS-R employs InFO technology to replace the silicon interposer of CoWoS-S with an organic interposer. This organic interposer has fine-pitch RDL (Redistribution Layer), providing high-speed connections between HBM and SoC chips or between chips and substrates.

2024年5月15日 · Chip-on-Wafer-on-Substrate (CoWoS) is a two-point-five dimensional integrated circuit (2.5D IC) through-silicon via (TSV) interposer -based packaging technology designed by TSMC for high-performance applications.

CoWoS-R: This technology replaces the silicon interposer of CoWoS-S with an organic interposer. The organic interposer has fine-pitched RDL to provide a high-speed connection between the HBM and the die or even between the die and the substrate.

2024年10月5日 · We know that CoWoS can be divided into three types: CoWoS-R, CoWoS-S, and CoWoS-L. Among them, CoWoS-R is relatively simpler because it mainly involves stacking layers of PI (polyimide) material, which we refer to as RDL (Redistribution Layers).

2022年5月31日 · CoWoS-R provides low RC interconnect with good signal isolation and design scalability. The new organic interposer CoWoS-R + (plus) successfully integrates both a large amount of high density IPD (integrated passive device) and fine pitch Si-based connection block for convenient IP migration.

CoWoS® is a platform provides best-in-breed performance and highest integration density for high performance computing applications. This wafer level system integration platform offers wide range of interposer sizes, number of HBM cubes, and package sizes.

In the study, UCIe IO circuit with data rate up to 32GT/s is implemented on the CoWoS-R technology, the solutions to mitigate the crosstalk of the high-speed transmission line from RDL line arrangements are explored for signal integrity (SI) performance.

CoWoS® platform provides best-in-breed performance and highest integration density for high performance computing applications. This wafer level system integration platform offers wide range of interposer sizes, number of HBM cubes, and package sizes.