2024年8月8日 · CoWoS-L is a back-end chip packaging method within the CoWoS platform that combines the advantages of CoWoS-S and InFO technologies. It uses an LSI chip interposer to provide the most flexible integration for chip-to-chip interconnection and RDL layer power and signal transmission.

Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I/O connections. It allows 2.5D and 3D stacking of components to enable homogenous and heterogenous integration.

Key CoWoS ®-L features include: LSI chips for a high routing density die-to-die interconnect through multiple layers of sub-micron copper lines. LSI chips can feature of a variety of connection architectures, e.g., System on Chip (SoC)-to-SoC, SoC-to-chiplet, SoC-to-High Bandwidth Memory, within each product, and can be used repeatedly in ...

CoWoS®-L For Heterogeneous Integration • Leverage InFO and CoWoS to integrate Si bridge, passives and RDL to best optimize CT, yield learning, system performance and EoS, etc.

2020年8月25日 · CoWoS-L is the new variant of TSMC’s chip-last packaging technology which adds in the Local Si Interconnect which is used in combination of a copper RDL to achieve higher bandwidth than just...

2025年1月18日 · CoWoS-L (Chip-on-Wafer-on-Substrate with Local Silicon Interconnect) represents a significant advancement over CoWoS-S in terms of performance and efficiency for high-end computing applications...

2024年12月21日 · CoWoS-L combines silicon interposer and fan-out technologies to enable flexible integration of chiplets and components. It uses an interposer with LSI (Local Silicon Interconnect) for efficient die-to-die interconnects and RDL …

2025年1月16日 · TSMC's CoWoS-S is a high-end 2.5D packaging technology that uses a silicon interposer to connect chiplets in a system-in-package. This technology has been good enough for Nvidia's...

2024年5月15日 · Chip-on-Wafer-on-Substrate (CoWoS) is a two-point-five dimensional integrated circuit (2.5D IC) through-silicon via (TSV) interposer-based packaging technology designed by TSMC for high-performance applications.

2023年5月30日 · In this paper, we introduce CoWoS-L, a new architecture in the CoWoS family, to address the large Si interposer defect-driven yield loss concern. The interposer of CoWoS-L includes multiple local Si interconnect (LSI) chip lets and global redistribution layers (RDL) to form a reconstituted interposer (RI) to replace a monolithic silicon ...