A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins that can be put on a dual in-line or flat package.

2024年1月5日 · BGA packages are found on pcDuino and Raspberry Pi boards. Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT.

BGA packaging can be used for high-performance applications with high thermal and electrical re-quirements. BGAs fit ICs into a smaller footprint, decreasing pitch spacing, by utilizing an array of solder ball connections.

为满足发展的需要，在原有 封装 品种基础上，又增添了新的品种——球栅阵列封装，简称BGA (Ball Grid Array Package)。 采用BGA技术封装的内存，可以使内存在体积不变的情况下内存容量提高两到三倍，BGA与TSOP相比，具有更小的体积，更好的散热性能和电性能。 BGA封装技术 使每平方英寸的存储量有了很大提升，采用BGA封装技术的内存产品在相同容量下，体积只有 TSOP封装 的三分之一；另外，与传统TSOP封装方式相比，BGA封装方式有更加快速和有效 …

2024年2月23日 · BGA 是 PCB 上常用的组件，通常 CPU、NORTH BRIDGE、SOUTH BRIDGE、 AGP CHIP、 CARD BUS CHIP…等，大多是以 bga 的型式包装，简言之， 80﹪的 高频信号及特殊信号将会由这类型的 package 内拉出。

BGA , or Ball Grid Array, is a kind of a surface mount package which is used in electronic products to mount integrated circuits such as microprocessors, FPGAs, WiFi chips etc.

2024年4月10日 · IC 封装基板（IC Package Substrate，简称 IC 载板，也称为封装基板）是连接并传递裸芯片与PCB之间信号的载体，是封装环节最关键的原材料之一。 其市场空间广阔，种类繁多，类别多样。

Texas Instruments (TI ) Flip Chip Ball Grid Array (BGA) packages provide the design flexibility to incorporate higher signal density and overall IC functionality into a smaller die and package footprint.

Using the underside of the IC package instead of connections around the edge makes it possible to reduce connection density, hence facilitating PCB layout. Using the underside of the chip prevents direct access to the connections, which makes soldering, desoldering, and inspection more challenging.

2025年2月11日 · Ball Grid Array or BGA is a surface-mount package (SMD Component) with no leads. This type of surface-mount packaging is used in Surface Mount Technology (SMT) and utilizes an array of metal spheres called solder balls for electrical interconnection. Solder balls are attached to a laminated substrate at the bottom of the package.