NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class. Aiming at today’s, and future placement demands, NANO enables the reliable handling of ultra-small and very thin die.

Specially designed for low pin count flip chip packages, AD8312FC provides a high speed automatic flip chip bonding solution for packages such as SOIC, SO, QFN, BGA, LGA and more. In order to handle versatile packages, it is also able to handle direct die bonding process.

專為低腳數的覆晶器件而設，AD8312FC 為多種器件，如 SOIC, SO, QFN 等，提供一個全自動高速覆晶方案。 為了能處理多元化器件，AD8312FC 同時配備直接固晶系統。 擁有高速、精確的固晶能力，MS Windows® 操作系統及靈活聯機能力，AD8312FC 是您高產量覆晶封裝方案的不二之 …

Excellent XY placement accuracy, 300 x 100 mm high-density lead frame handling, equipped with uplook optics to enhance bonding accuracy. Complete with a universal work holder design for various packages.

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.

特色. 二合一覆晶及直接固晶机 两种工艺的转换简单容易; 使用已注册专利的高速焊头系统，达至领先的固晶速度

2023年7月9日 · 尤其以引线键合(Wire Bonding)及倒装连接(Flip Chip Bonding)最为常见，因为 载带连接 技术(TAB)有一定的局限性，封装上逐渐淘汰了这种技术。 倒装芯片技术 是通过芯片上的凸点直接将元器件朝下互连到基板、载体或者电路板上。

本页内容为您提供晶圆级Flip-chip解决方案详细介绍，精选晶圆级Flip-chip解决方案信息，提供晶圆级Flip-chip解决方案优质的服务，晶圆级Flip-chip解决方案为深圳市倍特盛电子科技有限公司整理发布。

Supporting flip chip and direct die attach mode with local and global alignment, including flux dipping; Capable of direct handling of bare wafer substrate, wafer on carrier or substrate on carrier; Support high bond force and thermal process; Multi-chip bonding capability with an automatic tool changing system; Class 100 cleaning standard ...

AD9212Plus . AUTOMATIC Flip Chip Bonding System . ASM Pacific Technology . http://www.asmpacific.com . ASMPT – Automatic Dual Head. Intelligent Features