Bow and warp of semiconductor wafers and substrates are measures of the flatness of wafers. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from …

After being subjected to high temperature passivation processes, the film stress can increase significantly and lead to warped wafers. Warpage of various metalized wafers was …

Wafers warp. It is important to minimize warpage in order to achieve optimal die yield and potentially prevent future device failure. Although the word warpage is widely used in the …

2024年12月13日 · What is Wafer Warpage? Wafer warpage refers to the bending or non-flatness of a wafer surface during manufacturing or processing. It is typically measured as the …

2015年4月1日 · Mechanism of wafer warp in diamond thinning is revealed based on elasticity theory. A mathematical model is established for predicting wafer warp in diamond thinning. …

2022年2月15日 · The warping deformation of YAG wafers in self-rotating grinding is related to the subsurface damage depth, residual stress, and the thickness and mechanical properties of …

2014年10月24日 · By analyzing the interactions between the wafer and the vacuum chuck, together with the machining stress distributions in damage layer of ground wafer, the study …

2024年8月21日 · Wafer bow and warp introduce stresses and non-uniformities into the wafer surface that can negatively impact lithography, overlay, feature dimensions, and more. …

Wafer warping is caused by high residual stress of the polycrystalline silicon layers. Hence, understanding of the origin of residual stress induced in polycrystalline silicon layers and the …

Wafer warping from a grinding-based thinning process is reportedly related to grinding damage and residual stresses. Assuming a uniform layer of grinding-induced damage, Zhou et al. [5] …

By analyzing the interactions between the wafer and the vacuum chuck, together with the machining stress distributions in damage layer of ground wafer, the study establishes a …

Wafer warpage is measured at room temperature using a laser interferometer. The finite element model is constructed by using the 2D axisymmetric hypothesis. Intrinsic stress effects were …

We investigate the Wafer-to-Wafer (W2W) bonding process-induced warpage issue with experiments and a full wafer simulation. A concave wafer warpage of 70 μm is observed for a …

2015年4月1日 · This study investigates warping of silicon wafers in ultra-precision grinding-based back-thinning process. By analyzing the interactions between the wafer and the vacuum …

We demonstrate a local (device-level) to global (wafer-level) scale finite-element modeling approach that can be used to evaluate wafer warpage with scaling trends and offer potential …

2025年3月7日 · In wafer manufacturing, TTV, Bow, and Warp are essential parameters that determine wafer flatness and thickness uniformity, significantly impacting critical chip …

2016年12月28日 · We presented in detail a nonlinear analytical approach with eight free parameters to describe the warping behaviour of a thin large anisotropic wafer with a thin film …

2004年9月27日 · Thinning below 305um induces significant warp in product/metal wafers, which continues to increases as wafers are thinned further. Increased wafer warp results in …

2012年4月25日 · Reducing TSV wafer warpage is one of the most challenging concerns for successfully subsequent processes. In this paper, a wafer-level warpage modeling …

Abstract: In this study, we demonstrated a TSV wafer with hybrid via with fine pitch of 6 μm and 9 μm. An effective finite element analysis (FEA) modeling methodology was developed for …