203 total package options for the Texas Instruments Small Outline (SO). Use the filter panel to further refine your search.

Read our definitions for common package groups, families and preference codes, along with other important terminology when evaluating our packaging options. Home Packaging

PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners …

packages (TVSOP) to support the component miniaturization requirements of the industry. The new TVSOP package family, in 14-, 16-, 20-, 24-, 48-, 56-, 80-, and 100-pin types, features a …

A case study of the LM2652 in a 28-lead e-TSSOP package demonstrates the PCB design impact on θJA, and generates design recommendations to improve the thermal performance. Five …

In this article, I’ll present an overview of the most widely used package types used for power electronics devices and their influence on EMI. There are three common package types used …

SOIC-20 (DW) SSOP-20 (DB) TSSOP-20 (PW) TVSOP-20 (DGV) QFN-20 (RGY) Length (mm) 12.825 ± 0.13 7.20 ± 0.30 6.50 ± 0.10 5.00 ± 0.10 4.50 ± 0.15 Width (mm) 10.40 ± 0.25 7.80 ± …

The SOIC, TSSOP, and VSSOP packages commonly used throughout the industry have an industry-standard pinout that equips designers with many options for a second source. The …

The TPS71xx family is available in PDIP (8 pin), SO (8 pin), and TSSOP (20-pin) packages. The TSSOP has a maximum height of 1,2 mm. The TPS71xx integrated circuits are a family of …

Pad-Up PowerPAD™ packages should have appropriately designed heat sinks attached. Because of the variation and flexible nature of this type of heat sink, additional details should …