In electronics, TO-5 (Transistor Outline 5) is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC. [1]

2 Lead TO-3 Metal Can Package, Aluminum NS Package Number KC02A

2015年10月27日 · TO-5 (Transistor Outline 5) is a family of older-style through-hole metal can component packages. The most popular variant is the TO-5-3 (3 lead variant), but variants …

Our advanced TO-5 package and TO-5 transistors, renowned for their robustness and efficient heat dissipation. The TO-5, also known as TO-205AA, is a metal can transistor package ideal for high-power applications, including RF and microwave systems, industrial equipment, and …

The TO-5 is a type of 'metal can' package (also known as 'metal header' package) for semiconductor devices. It is hermetically sealed to protect the device from environmental factors such as contaminants and moisture. The TO-5 is commonly used in housing transistors and integrated circuits with low lead counts such as operational amplifiers.

The transistor outline (TO) package family consists of many types of packaging solutions for transistors and similar discrete devices as well as simple IC's with low pin counts. The structures of TO packages vary widely, from expensive metal can enclosures to low-cost plastic-molded package bodies (see Table 1 below). Table 1.

In electronics, TO-5 (Transistor Outline 5) is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC. [1]

小形で高トルク伝達を実現。 定位置連結・停止や同期運転に最適。

2009年1月1日 · TO-5 and TO-100 transistor sockets make field insertion and removal of transistors and diodes easy and convenient. Inside each transistor socket are precision machined, brass alloy receptacles assembled with a Mill-Max, 4-finger contact. providing a hi-rel mechanical and electrical connection to the mated transistor lead.

2021年6月19日 · 本图仅供参考!因现在很多生产商发布封装尺寸不尽统一,我们也不能一一录入,只是尽力挑选有代表性的封装图片来参考.另外封装后面有“EP”结尾的是指底部带有散热片的。 还有TSOT与SOT的差别，据分析TSOT的耗散功率较SOT的大些，有的人说TSOT厚度更厚一些，但也有例外，如AD公司的TSOT是薄的。