
TO-3 - Wikipedia
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.
2 Lead TO-3 Metal Can Package, Aluminum NS Package Number KC02A
TO-3 Package - eesemi.com
The TO-3 or TO3 is a type of 'metal can' package that is capable of high-power dissipation commonly used by power transistors, SCR's and other high-power semiconductor devices. The TO-3 is made entirely of metal, with the microchip mounted on its metal can base and then covered with a metal cap.
What is the difference between TO-3 and TO-204AA packaging?
2020年11月1日 · KiCad does not have TO-204AA but it has TO-3. Looking at the image below you will see that there is a difference of approximately +- 0.45 millimeters between the two packages.
TO-3 Transistors – Mouser
TO-3 Transistors are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for TO-3 Transistors.
TO-3 Component Package - mbedded.ninja
TO-3 is a family of large through-hole metal can packages used for things such as transistors, linear regulators and op-amps. There are 2 lead (common), 3 lead (common), 8 lead (rare), and 15 lead (very rare) variants.
TO-3 SOCKET The Burr-Brown 0804MC TO-3 socket is designed to meet the requirements of high current, high power products such as the OPA512, OPA541, and OPA2541. The socket has a rugged contact design which assures positive and reliable not recommended.
Transistor Outline (TO) Package Types
The transistor outline (TO) package family consists of many types of packaging solutions for transistors and similar discrete devices as well as simple IC's with low pin counts. The structures of TO packages vary widely, from expensive metal can enclosures to low-cost plastic-molded package bodies (see Table 1 below). Table 1.
BOTTOM VIEW OF TO-3P HATCHED AREA IS SOLDER PLATED COPPER HEAT SINK
TO-3P (N) - Toshiba Electronic Devices & Storage Corporation
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the …