2025年3月24日 · Laird Tputty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind. Laird has leveraged its knowledge of thermally conductive fillers and resin systems to develop a single part dispensable that demonstrates reliability in a variety of application orientations.

Laird T-Putty™ 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind.

PuTTY is an SSH and telnet client, developed originally by Simon Tatham for the Windows platform. PuTTY is open source software that is available with source code and is developed and supported by a group of volunteers.

T-puttyTM 502 is the best material for applications where large tolerance differences create the need for compression of the interface material beyond 50% of its original thickness. T-puttyTM 502 will flow and ensure low pressures on the components being cooled.

T-putty系列是Laird推出的一款适合应用于大公差应用的导热填隙材料。 此系列产品具有可流动的特性，相比起传统的导热界面材料，T-putty系列只会对器件产生很小，甚至不会产生压力。

2020年6月2日 · Laird Performance Materials TPutty™ Gap Fillers are soft, low abrasive, silicone-based thermal gap fillers that are ideal for applications where large or uneven gap tolerances are present.

2024年4月18日 · Tputty 508 is ideal for applications that can benefit from automation, and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty™ 508 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer.

Laird T-Putty 508 is a thermal paste designed for heat dissipation in electronics applications.

2012年6月29日 · Laird Thermal's Tputty 502 series is the best material for applications where large tolerance differences create the need for compression of interface material beyond 50 percent of its original thickness. Tputty 502 flows to ensure low …

T-putty™ 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present. The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance. T-putty™ 504 is soft and compliant transferring little to no pressure between interfaces. Because T-putty™ 504 has a