Solder ball - Wikipedia
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; [1] in the latter case, they may be referred to as microbumps (μbumps ...
Solder Bump: Chip Interconnection and Assembly to PCB - MADPCB
In Integrated circuit (IC) packaging, a Solder Bump, also a Solder Ball, or referred simply as “ball” or “bumps”, is a ball of solder that provides the contact between chip package and printed circuit board, as well as between stacked packages in multichip modules.
Solder Bump Bonding, Ball Bumps and Wire Bonds - Palomar® …
2010年5月24日 · Solder Bumps are the small spheres of solder (solder balls) that are bonded to contact areas or pads of semiconductor devices. Subsequently, they are used for face-down bonding. The length of the electrical connections between …
Solder Bump - an overview | ScienceDirect Topics
There are several common technologies to form solder bumps, including solder evaporation, electroplating, stencil printing, placing preformed solder spheres, and C4NP (C4 new process, C4: controlled collapse chip connection) [82].
The back-end process: Step 7 – Solder bumping step by step
The solder bump or ball serves as the interconnection point between device and board. If the system is designed properly, failure will occur within the solder as predicted by known reliability models.
Solder Bump Analysis - Bowman XRF
Solder bumps (or solder balls) are tiny balls of solder used in integrated circuit packaging to provide contact between chip packaging/substrate and PCBs. Solder bumps are often used in BGA (ball grid array), CSP (chip scale packaging), flip chips and microBGAs.
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These include electroplating, solder paste printing, evaporation and the direct attach of preformed solder spheres.
In this paper we will present new cost-efficient solder bumping and adapted assembly technologies for the processing of flip-chips with a pitch of 100 μm or less and solder ball diameters of 60 μm or 50 μm, respectively. The wafer bumping has been realized using a highly efficient Wafer Level Solder Sphere Transfer (WLSST) process.
Solder Bump Plating - DuPont
DuPont Electronics and Industrial award-winning SOLDERON™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping fine-pitch Cu µpillars.
In an effort to improve solder joint reliability, we have developed a stacked solder bumping technique for fabricating high standoff triple-stacked hourglass/column-shaped solder joints. This solder bumping technology can easily control the solder joint shape and height.