SMAFTI package with planarized multilayer interconnects
2009年6月12日 · A hybrid multilayer interconnect process and high-throughput die-to-wafer bonding technology were developed and introduced into the SMAFTI (SMArt chip connection …
A 3D Stacked Memory Integrated on a Logic Device Using SMAFTI ...
SMAFTI technology, featuring an ultra-thin organic interposer with high-density feedthrough conductive vias, was introduced for interconnecting the 3D stacked memory and the logic …
SMAFTI packaging technology for new interconnect hierarchy
We have developed a 3-D packaging technology called SMAFTI (SMArt chip connection with FeedThrough Interposer), which enables the implementation of a new memory/logic …
To solve these problems, we have recently developed a general-purpose LSI package1) that connects a large-capacity memory to a logic LSI via a wide bus of some hundreds of bits, and …
SMAFTI packaging technology for new interconnect hierarchy
2009年7月3日 · We have developed a 3-D packaging technology called SMAFTI (SMArt chip connection with FeedThrough Interposer), which enables the implementation of a new …
A 3-D Packaging Technology with Highly-Parallel Memory…
A three-dimensional semiconductor package structure with inter-chip connections was developed for broadband data transfer and low latency electrical communication between a high-capacity …
A novel "SMAFTI" package for inter-chip wide-band data transfer
2006年5月30日 · Abstract: A package structure with inter-chip connection is proposed for broadband data transfer and low latency electrical communication between a high-capacity …
突破速度、互连障碍，NEC最新系统级封装技术震撼登场-电子工程 …
2006年8月8日 · NEC透露说，Smafti技术是利用三种关键技术开发而成的：50微米间距微焊点互连技术，连接性能超群的15微米厚导通转接板技术，以及多片组装技术。 NEC表示，基 …
A novel SMAFTI package for inter-chip wide-band data transfer
2006年1月1日 · Using such a fine interposer, the SMAFTI (SMArt chip connection with FeedThrough Interposer) package that we suggest can provide a wide-band inter-chip …
NEC电子新型SiP封装满足便携式高清视频内容需要-电子工程专辑
2006年8月8日 · NEC公司日前开发出一项新型SiP(系统级封装)技术——SMAFTI(smartchipconnectionwith feedthrough interposer)，据称，该技术可将逻辑LSI和 …