By definition, a heat sink is an added low thermal resistance device attached to an IC to aid heat removal. A heat sink has additional thermal resistance of its own, θCA, rated in °C/W. However, most current op amp packages don't easily lend themselves to heat sink attachment (exceptions are older TO-99 metal can types).

Heat Slug in Figure 3(d) provides im-provement by creating a path from the die pad of the leadframe to the external surface of the package with a metal (typically copper) slug, and the Leadframe Attached Heat Slug of Fig-ure 3(e) creates an additional path for heat to the lead fingers of the leadframe. Each of these versions

To make optimum use of the thermal efficiencies designed into the PowerPADTM package, the PCB must be designed with this technology in mind. In order to leverage the full thermal performance benefits offered from the PowerPadTM package, the exposed pad must be …

PowerPADTM thermally enhanced package solutions patented by Texas Instruments, provide a cost efficient method of improving traditional plastic package heat transfer from the semiconductor device junction to the printed circuit board (PCB) or system level thermal management system when compared to conventional heat spreader, heat slug, or metal ...

IC封裝用散熱片, 使用導熱性佳、質輕、易加工之金屬材料 (多為鋁或銅), 貼附於IC發熱表面，以複合的熱交換模式來散熱。 封裝後產品主要應用於5G相關。 IC封裝用散熱片, 使用導熱性佳、質輕、易加工之金屬材料 (多為鋁或銅), 貼附於IC發熱表面，以複合的熱交換模式來散熱。 封裝後產品主要應用於5G相關。 IC封裝用散熱片, 使用導熱性佳、質輕、易加工之金屬材料 (多為鋁或銅), 貼附於IC發熱表面，以複合的熱交換模式來散熱。 封裝後產品主要應用於5G相關。 IC封裝用散熱 …

Evolution of SMT drove the development of several new packages for discrete and IC devices: SOT23, SOT194, TO263, SO, PLCC, PQFP with many options in pin pitch, size and thickness. All of them are compatible with the surface mount technique, based on fast picking and placing from tapes or trays, followed by mass soldering.

Abstract: The thermal consumption of IC package becomes getting higher and higher when the device is running at full speed in a tiny space, especially the IC packages become toward small form factor, light weight, high I/O, more functionality and systems integration. The HSBGA (Heat Slug BGA) has hat-type heat slug added on the top side of BGA ...

The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power. The PSOP achieves 40% theta JA improvement over that of standard SOIC's.

Computer simulated thermal resistance data is provided by using different thermal techniques. All Apex Microtechnology thermally enhanced SMT packages that feature Apex Microtechnology® tech-nology have a heat slug on which the power chip is attached. The power chip is the heat source from which the heat is transferred to the heat slug.

2020年6月17日 · 本文以SOP封装为例，介绍使用Flotherm对芯片封装进行热仿真分析及优化的流程。 仿真目标是确定保证芯片结温低于150℃且热量能够正常耗散的最大功耗值。 SOP封装的尺寸如下图所示。 SOP封装在PCB板上的安装形式及测温点的位置如下图所示。 分别对没有散热器和有散热器两种情况进行仿真，在有散热器的情况下在PCB板和散热器基板之间有导热胶进行连接。 仿真使用的PCB板为59x61mm的6层板，假设每层的覆铜率在每层内分布是均匀的。 基于该 …