2015年10月21日 · Double-side SiC coating is demonstrated to be an effective way to minimize wafer bow, with a bow value of smaller than 20 μm compared to a value of 76.75 μm for single …

In this paper, the parameters influencing the roughness, crystalline quality, and wafer bow are investigated and engineered to obtain high quality, low roughness 3C-SiC/Si templates suitable...

2022年12月1日 · SSD from wafering operations located on the wafer surface can significantly impact the shape (Bow, Warp, and TTV) of SiC wafers and can be considered a thin film under …

Bow指晶圆在未紧贴状态下，晶圆中心点表面距离参考平面的最小值和最大值之间的偏差，偏差包括凹形和凸形的情况，凹形弯曲度为负值，凸形弯曲度为正值；一般以微米(μm)表示，一般表 …

2020年5月3日 · 我们在查阅半导体硅片或其它类型材料的衬底、晶片时，常常会看到诸如：ttv、bow、warp，甚至可能看到tir，stir，ltv等这类技术指标，他们表征的是什么参数呢？

2023年6月1日 · The increase of the radius for crystal B further proves that the modifications of the growth process led to a reduced amount of stress during and after the growth. 26 m is still a …

2019年11月18日 · As a semiconductor substrate, the SiC wafer not only needs good surface quality but also requires surface shape accuracy. In the present study, a novel lapping plate …

In this study, the wafer distortion (bow, the deformation of the median surface of a free and unclamped wafer at the center point) induced by ion implantation has been investigated and …

2011年2月1日 · Single-side polished silicon carbide wafers could exhibit large bow and warp due to the presence of mechanical damage on the unpolished surface. In this study, we …

2021年9月30日 · Grinding wheels manufactured with this technology can accomplish ultra-smooth SiC (Ra = 0.55 nm and TTV < 1 μm) surfaces due to their unique bonding structure and their …