Keeping the core and prepreg in the same grain direction is crucial to ensure the flatness of multilayer boards. Grain direction is shown on the certificate of conformance. Rheology of resin controlled to benefit the lamination of the boards. Modified phosphorous epoxy provides excellent heat and chemical resistance.

产品说明： 1.無鹵素環保材，tg150℃，耐熱性與加工性提昇 2.厚度規格：0.05~1.6mm 3.南亞銅箔秉持追求品質、降低成本、環境保護原則，各生產工廠皆已取得iso-9001、iso-14001、ohsas-18001 認證。

NPG -151B FEATURES Rheology of resin controlled to benefit the lamination of the boards. Modified phosphorous epoxy provides excellent heat and chemical resistance. Other properties are similar to standard FR-4 PERFORMANCE LIST Specification : IPC-4101C is applicable Data shown are nominal values for reference only. Glass style RC% RF% GT sec

南亚电子材料部已经开发完成高耐热性／低膨胀性／低介电性适用无铅制程的无卤素环保材料/无卤无铅基板，可完全供应PCB 客户无铅无卤基板材料市场；南亚完整的产品线及垂直整合的优势可满足日渐高阶化PCB的无卤无铅基板应用需求。 特 色. 1.产品设计可符合无铅制程组装（2层~24层以上） 2.产品设计可承受多次288℃漂锡制程，高裂解温度(Td) 3.材料CAF抵抗能力1,000小时以上，适用于高可靠PCBs. 4.优越的T260与T288时间分层(TTD)特性. 5.钻孔性、迭构、热压制程 …

NPG-151 - PCB Laminates from Nan Ya Plastics Corp. Get product specifications, Download the Datasheet, Request a Quote and get pricing for NPG-151 on PCB-Directory equipment Newsletter

High Tg (DMA> 300°C and ultra low C.T.E will provide excellent dimensional stability and through-hole reliability. (Anti-migration). Nan Ya substrate cores with low warpage trend. NPG-180IN and NPG-210 are designed with high Tg, low C.T.E and high stiffness to provide excellent thermal reliability and dimensional stability.

NPG-151. Flame retardant copper clad laminate Glass cloth base epoxy resin. Features. Halogen, antimony, and red phosphrous free; Flammability meets UL 94V-0; Excellent thermal resistance and reliablility; Lower C.T.E. will provide excellent dimensinoal stability and through-hole reliability; Excellent CAF-Resistance (Anti-migration)

NPG -151B FEATURES Rheology of resin controlled to benefit the lamination of the boards. Modified phosphorous epoxy provides excellent heat and chemical resistance. Other properties are similar to standard FR-4

Keeping the core and prepreg in the same grain direction is crucial to ensure the flatness of multilayer boards. Grain direction is shown on the certificate of conformance. Rheology of resin controlled to benefit the lamination of the boards. Modified phosphorous epoxy provides excellent heat and chemical resistance.

NPG-151, NPG-151B Features Besonderheiten Notice Hinweis . Performance List / Leistungsspektrum 1/2 . Performance List / Leistungsspektrum 2/2 O O. Layer Construction / Lagenaufbau . Press Cycle Recommendation / Verpressempfehlung Theoretical Thickness of Prepreg / theor. Prepregdicke