2020年5月25日 · Does my MiSTer need cooling? Yes, you will want at least a heatsink (passive cooling). 22mm x 22mm is the ideal size. 20mm x 20mm is more than enough however and is more common. Active cooling with a fan helps but is not strictly required.

2023年7月9日 · What kind of heatsink do I need for the Mister? I decided I want to go ahead and purchase one, but I want to make sure I have a nice one so decided to come on here to ask instead. If you buy a kit they usually provide one as well. The processor on the DE10-Nano is 21.5mm x 21.5mm so a heatsink that is around this size is suitable.

2024年3月12日 · You’re right, fans aren’t needed for the MiSTer, though a heat sink is recommended. MiSTer Addons did some tests and he also could not get the temperatures anywhere near 100C, exactly like what you’re seeing.

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Designed to cover the Cyclone V FPGA chip, ensuring maximum heat dissipation and keeping your DE10 Nano cool and running at peak performance. Installation of this solid copper heat sink adds highly efficient passive cooling for your MiSTer FPGA setup, when paired with a MiSTer IO Board with mounted fan you will have the ultimate active cooling ...

High quality all metal heatsink for the MiSTer FPGA Terasic DE10-Nano board with 3M 8810 thermal conductive adhesive applied for quick and easy mounting on the DE10-Nano. The hybrid ARM + FPGA chip can get very hot when running certain MiSTer cores as such some passive cooling is required.

This is a high quality heatsink that fits over the entire top of the DE-10's FPGA chip (and under the IO board). Completely cools the DE-10 under the IO board, making a fan optional. Comes with quality thermal adhesive!

2020年1月5日 · I'm trying to decide between a copper heatsink that is 25x25x7mm or one that is 25x25x11mm. I've read somewhere the height shouldn't exceed 10mm but since I'm planning to not use a populated IO board (just an empty pcb to mount a fan) shorting shouldn't be an issue. Any reason to not go for the 11mm version?

2024年1月9日 · MiSTer FPGA DE10 Nano Terasic Cooling Heat Sink. Suitable For Terasic Technologies DE10-Nano FPGA Board. The main heat source in the chip is the integrated dual-core ARM producing a constant heat regardless of the FPGA core use.