Intermetallic compounds (IMC) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies.

2024年2月20日 · Intermetallic Compounds (IMCs) are compounds formed by “fixed proportions” of two or more metallic elements through a “chemical reaction,” resulting in a pure substance. Examples include Cu 6 Sn 5 、Ni 3 Sn 4 、AuSn 4, and similar substances. (IMC can also form under ambient temperature through diffusion, but the process is very slow)

IMCs are generated when two or more metallic elements come together to form a new phase having its own characteristics, crystal structure, and composition. The IMC phase could form in bulk solder during soldering application and at the interface between substrate and solder.

The intermetallic Cu6Sn5 is important due to the large number of tin-lead and lead-free solder joints formed directly to copper. This IMC forms an interfacial layer and can be found in the bulk microstructure of tin-lead solder joints where excessive time and temperature are involved during the soldering process.

The technique used to determine IMC layer thickness in Tin surfaces, such as Immersion Tin, consists of a combination of X-Ray Fluorescence (XRF) and Coulometric Stripping (CM) methods[9]. This method is new, however, uses two very known techniques for Immersion Tin Measurements[10]. A brief description of its three steeps is done next.

2021年7月28日 · 在各种焊料合金中，大量的Sn是主角，它是参与IMC形成的主要元素。其余各元素仅起配角作用，主要是为了降低焊料的熔点以及压制IMC的生长，少量的Cu和Ni也会影响IMC的结构。 ( a" i7 k; o0 L% Q 2 i, ]5 f5 Z# K! J$ @$ f! O $ F6 d% g0 T& y

Immersion tin is not suitable for wire bonding but ultimately suited for multiple soldering applications. The dominant topics of this paper will be IMC formations in relation to reflow …

2023年10月11日 · Intermetallic compounds (IMC) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the...

2019年6月10日 · SAC solders with high Ag content (>3 wt.%) have good cyclic thermal properties. However, the formation of a large amount of Ag 3 Sn intermetallic compound (IMC) results in non-homogeneous stress...

2022年4月29日 · 焊点的形成过程可分为三个阶段:焊料润湿 (铺展)、基底金属熔合/扩散和金属间化合物 (IMC)的形成，如图所示。 金属间化合物，英文全称为IntermetallicCompound，缩写为IMC，它是界面反应的产物，也作为形成良好焊点的一个标志。 在各种焊料合金中，大量的Sn是主角，它是参与IMC形成的主要元素。 其余各元素仅起配角作用，主要是为了降低焊料的熔点以及压制IMC的生长，少量的Cu和Ni也会影响IMC的结构。 在有铅工艺条件下，锡铅焊料与Cu、Ni …