By employing the new element technology, the Z05 series allows to select bond from two types. A wide range of workpieces from processing of hard and brittle materials to dicing of each type of semiconductor package can be achieved. Up to 6 concentration …

透過集中度的細分化，您可使用到兼具了加工品質（特别是背面崩缺）和使用壽命的新型切割刀片。 縮短預切割時間，並採用了降低晶粒飛濺及破損的技術。 在切割加工中，集中度 ※ 會影響研磨顆粒的磨耗量（使用壽命），透過集中度的高精度控制，可使切割刀片磨耗量及加工品質更趨於穩定。 ※集中度是指在切割刀片中，鑽石研磨顆粒所占有的體積比例值。 例如，集中度100指的是，研磨顆粒所占體積為25 %的狀態。 ZH05因為增加了集中度的選項，可更加準確地滿足用戶 …

Dicing Blades. 该产品被安装在切割机·切断机上，可对硅晶片或其他材料的加工物进行切割·开槽等「Kiru（切）」加工。

通过集中度的细分化，兼备了加工品质高（特别是背面崩缺-chipping）和使用寿命长的新型切割刀片。 在切割加工中，集中度 ※ 会影响到磨粒层的消耗速度（使用寿命）以及加工品质（崩缺-chipping尺寸），通过集中度的高精度控制技术，使切割刀片消耗量及加工品质更趋于稳定。 ※ 集中度是指在切割刀片中，金刚石（钻石）磨粒所占有的体积比例值。 例如，集中度100就是表示金刚石（钻石）磨粒所占的体积为25 %。 ZH05扩大了集中度的选择范围，可更加准确地满足用 …

DISCO's dicing saws can offer higher singulation throughput and productivity as well as less copper burring, while DISCO's new resinoid blade for package singulation can significantly improve process quality. CCD and CMOS image sensors, now quite common in digital cameras and mobile phones, are extremely sensitive to particles.

A combination of an ultrathin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO’s vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.

Through the proper blade, processing conditions, and the DISCO Short Kerf Check function, it is possible to dice thin wafers with extremely high processing quality. Please contact your DISCO representative for further details about thin wafer dicing …

Dicing is a process for cutting and making grooves on board-type workpieces approx. 10 mm thick using dicing blades. Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. 0.01 - …

在这里将向大家介绍可对QFN实施高质量加工（减少毛刺的发生及提高生产率）的新型树脂结合剂磨轮刀片和适用于加工QFN的切割机。 现在，用于手机、数码照相机等领域的CCD/CMOS图象传感器对于无切削微粒粘附的品质要求正在变得越来越严格。 此外，在各种IC元件领域也发生因切削微粒附着在接线头处而导致其接线不良等问题。 因此如何去除切削微粒已成为目前迫切需要解决的 …

In combination with DISCO’s vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs. Reduces blade breakage and wavy cutting for thin kerfs. Enables stable processing of narrow streets. Ultrathin 10 µm hub blade.