The Analysis of Multiwall Carbon Nanotubes as Through Silicon …
To evaluate the electrical characteristics of CNT TSV with different realistic temperatures, the considerations of temperature-dependent electron mean free path (MFP, $\lambda$ ), and …
A Modeling Study on Electrical and Thermal Behavior of CNT TSV …
2023年7月31日 · We find that CNT TSV has good electrical properties, comparable transmission loss with Cu TSV, and better heat dissipation capabilities, suitable for 3-D integration circuits …
Integration of CNT in TSV (≤5 μm) for 3D IC ... - IEEE Xplore
2014年1月9日 · Here, we demonstrate a method to integrate carbon nanotubes (CNTs)-filled TSV under 5 μm diameter that are connected by metal-lines at the bottom and show the facile route …
Review article Technology review of CNTs TSV in 3D IC and 2.5D ...
2024年7月15日 · Through‑silicon via (TSV) is one of the most important features in 3D integrated circuit (IC) and 2.5D packaging. Both are within the advanced packaging topic for the digital …
3D IC 和 2.5D 封装中碳纳米管 TSV 的技术综述：电学角度的进展 …
硅通孔 (TSV) 是 3D 集成电路 (IC) 和 2.5D 封装中最重要的功能之一。 两者都属于符合超越摩尔范式的数字和模拟 IC 的先进封装主题。 本文回顾了碳纳米管 (CNT) TSV 技术的提议和进展， …
<br>多层结构碳纳米管硅通孔电热行为的建模 ... - X-MOL
2023年7月31日 · 最近提出碳纳米管 (cnt) 作为硅通孔 (tsv) 的替代材料，以满足高密度缩放和 3d 堆叠的要求。本文通过建立物理模型并应用comsol仿真，分析了多层结构中cnt tsv的电学和热 …
Performance analysis of Cu/CNT-based TSV: impact on ... - Springer
2022年9月4日 · Using the physical configuration of different TSV shapes, an equivalent circuit model of a Cu- and CNT-based signal-ground TSV pair is demonstrated in Figs. 3 and 4, …
Technology review of CNTs TSV in 3D IC and 2.5D packaging:
2024年7月15日 · This article revisits the proposal and progress of carbon nanotubes (CNTs) TSV technology that potentially offers an improvement over the conventional Cu TSV. Today, CNTs …
A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, …
2023年7月17日 · In this article, we propose a position-oriented carbon nanotube (CNT) sampling method based on the Monte Carlo (MC) concept, which obtains the relative positional …
Spray mist-assisted drilling of through silicon vias (TSV) using ...
2024年7月1日 · Four environments such as air, compressed air jet, water mist, carbon nanotube (CNT) fluid mist were employed to assess laser machining effects on TSV performance in …