Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (FBGA) offers a …

The near chip size CABGA fine-pitch BGA (FBGA) offers a broad selection of ball array pitches (≥0.3 mm pitch), ball counts and body sizes (1.5 mm to 27 mm body), single and multi-die …

CABGA or Chip Array BGA or CA Ball Grid Array serve as a packaging technology. It is mainly used in microprocessors and Integrated Circuits or ICs. In the packaging of CABGA, the IC, …

2018年1月6日 · The most recent CABGA achievement is the development of a maximum 0.4mm height fine-pitch ball grid array (FBGA), called X2FBGA (Table 1) to denote a double …

ChipArray ® Dummy (CABGA) packages are offered in laminate format and are available as Ball Grid Array. The near chip size standard outlines offer fixed body sizes and ball counts.

ChipArray® Packages (CABGA/fBGA) Amkor’s ChipArray® Ball Grid Array (CABGA) packages are laminate based packages that are compatible with SMT mounting processes worldwide. …

Expanding its ChipArray® Ball Grid Array (CABGA) package form factor miniaturization efforts, Amkor now offers a maximum 0.40 mm height CABGA assembly process. Amkor’s latest …

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions.

196-Ball Chip Array Ball Grid Array (GT) - 12x12 mm Body [CABGA] For the most current package drawings, please see the Microchip Packaging Specification located at …

22-Ball Chip Array Ball Grid Array (JY) - 5x7 mm Body [CABGA] For the most current package drawings, please see the Microchip Packaging Specification located at …