
VI-Process - ASMPT
The VI-Process is the most advanced use of the multi-beam concept. This process uses a combination of Multi-Beam patterns to achieve the highest die strength possible with today’s laser dicing processes.
Dicing UVP | ASMPT
We also have developed a VI-Process which allows full cut dicing of Low-K (thin) Si wafers including DAF or FOW while achieving high die strength (450-500Mpa) and low burr (<5µm) with a good quality and low CoO. The VI-Process allows customers to dice through the full stack of materials using a single process step.
ALSI LASER1205 | ASMPT SEMI Solutions
ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies.
Products - ASMPT
ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies.
ASMPT - Wikipedia
ASMPT (formerly ASM Pacific Technology) is a Singapore -headquartered company listed in Hong Kong that designs and manufactures machines and tools used in semiconductor and electronics assembly industries. It was originally the Asia division of ASM International (ASM).
半导体行业ASMI和ASML和ASMPT是怎样的关系? - 知乎
ASMI、ASML和ASMPT虽然名称相似,且都与半导体行业密切相关,但它们实际上是三个独立的公司,各自专注于不同的细分领域。 以下是这三个公司及其相互关系的概述: ASML Holding …
ASML的“三兄弟”往事|光刻机_新浪财经_新浪网
2020年6月9日 · 1988年,这些生产活动被公开列为ASM Pacific Technology(ASMPT)。 目前,该公司已成长为全球最大的半导体组装和封装技术供应商。 1984年,飞利浦和ASMI成立了合资企业。
ASMPT - Enabling the digital world
At ASMPT, we are changing electronics and semiconductor manufacturing with intelligent, customer-driven innovations. Our goal is to provide leading-edge solutions that exceed …
Enabling HBM 16H Stacks with ASMPT Fluxless AOR: Residue-free …
2024年12月17日 · Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package …
ASMPT Toolkit
ASMPT Toolkit You can find all printing, inspection, placement, storage and software documents with predictive search and extensive filtering options. Older documents are available in the archive. The popular i-Push and shopping cart functions continue to be available.