NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class. Aiming at today’s, and future placement …

Specially designed for low pin count flip chip packages, AD8312FC provides a high speed automatic flip chip bonding solution for packages such as SOIC, SO, QFN, BGA, LGA and …

專為低腳數的覆晶器件而設，AD8312FC 為多種器件，如 SOIC, SO, QFN 等，提供一個全自動高速覆晶方案。 為了能處理多元化器件，AD8312FC 同時配備直接固晶系統。 擁有高速、精確 …

Excellent XY placement accuracy, 300 x 100 mm high-density lead frame handling, equipped with uplook optics to enhance bonding accuracy. Complete with a universal work holder design for …

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as well as a modular machine …

特色. 二合一覆晶及直接固晶机 两种工艺的转换简单容易; 使用已注册专利的高速焊头系统，达至领先的固晶速度

2023年7月9日 · 尤其以引线键合(Wire Bonding)及倒装连接(Flip Chip Bonding)最为常见，因为 载带连接 技术(TAB)有一定的局限性，封装上逐渐淘汰了这种技术。 倒装芯片技术 是通过芯片 …

本页内容为您提供晶圆级Flip-chip解决方案详细介绍，精选晶圆级Flip-chip解决方案信息，提供晶圆级Flip-chip解决方案优质的服务，晶圆级Flip-chip解决方案为深圳市倍特盛电子科技有限公 …

Supporting flip chip and direct die attach mode with local and global alignment, including flux dipping; Capable of direct handling of bare wafer substrate, wafer on carrier or substrate on …

AD9212Plus . AUTOMATIC Flip Chip Bonding System . ASM Pacific Technology . http://www.asmpacific.com . ASMPT – Automatic Dual Head. Intelligent Features