We have developed a 3-D packaging technology called SMAFTI (SMArt chip connection with FeedThrough Interposer), which enables the implementation of a new memory/logic-interconnect hierarchy. Through experiments, we were able to confirm practical performance of …

A general-purpose 3D-LSI platform technology for a high-capacity stacked memory integrated on a logic device was developed for high-performance, power-efficient, and scalable computing. SMAFTI technology, featuring an ultra-thin organic interposer with high-density feedthrough conductive vias, was introduced for interconnecting the 3D stacked memory and the logic device. A DRAM-compatible ...

2006年5月30日 · Abstract: A package structure with inter-chip connection is proposed for broadband data transfer and low latency electrical communication between a high-capacity memory and a logic device interconnected by a feedthrough interposer (FTI) featuring a fine-wiring pattern and ultra-fine-pitch through vias.

2009年7月3日 · We have developed a 3-D packaging technology called SMAFTI (SMArt chip connection with FeedThrough Interposer), which enables the implementation of a new memory/logic-interconnect hierarchy....

To solve these problems, we have recently developed a general-purpose LSI package1) that connects a large-capacity memory to a logic LSI via a wide bus of some hundreds of bits, and named it the SMAFTI (SMArt chip con-nection with Feed-Through Interposer).

2009年6月12日 · A hybrid multilayer interconnect process and high-throughput die-to-wafer bonding technology were developed and introduced into the SMAFTI (SMArt chip connection with FeedThrough Interposer) package.

A three-dimensional semiconductor package structure with inter-chip connections was developed for broadband data transfer and low latency electrical communication between a high-capacity memory and a logic device interconnected by a feedthrough interposer (FTI) featuring a 10µm scale fine-wiring pattern and ultra-fine-pitch through vias.

2006年1月1日 · Using such a fine interposer, the SMAFTI (SMArt chip connection with FeedThrough Interposer) package that we suggest can provide a wide-band inter-chip connection between very high capacity...

A hybrid multilayer interconnect process and high-throughput die-to-wafer bonding technology were developed and introduced into the SMAFTI (SMArt chip connection with FeedThrough Interposer) package.…

2006年8月8日 · NEC透露说，Smafti技术是利用三种关键技术开发而成的：50微米间距微焊点互连技术，连接性能超群的15微米厚导通转接板技术，以及多片组装技术。