Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing ...
That arsenal includes YJ-18 anti-ship cruise missiles, CJ-10 land-attack cruise missiles, and HHQ-9 surface-to-air missiles (SAMs ... making it the first Chinese warship with dual-band planar radar ...
Recently, a research team from National Astronomical Observatories of Chinese Academy of Sciences and the University of Chinese Academy of Sciences jointly proposed a novel gravitational wave ...