“Four-point-bending (PB) tests were conducted on three thicknesses of G12 mono-Si wafers, and the load-displacement curves during the testing process were recorded.” This kind of testing is ...

CAD Rendering of the Final Assembly of Project SWCFI (Silicon Wafer Center-Finding Improvement). This project explores improving the inspection process of silicon wafers for quality control in the ...

Wafer chucks are also a critical product for a variety of substrate testing, metrology, and analysis steps in the manufacturing process such as spectrometry or compositional analysis, flatness or ...

As semiconductor fabrication technology has advanced to produce more sophisticated devices, wafer cassette design has kept pace. Semiconductor fabrication now involves higher automation levels, ...

Chinese 3D NAND and DRAM makers have been procuring new equipment and expanding their manufacturing capacity for several ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.