据了解，苹果将采用台积电先进的芯片封装技术，称为 SoIC-MH 或 System-on-Integrated-Chips-Molding-Horizontal，用于 M5 Pro、M5 Max 和 M5 Ultra。这意味着该公司将 ...

One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates ...

Apple is expected to revolutionize its chip design by incorporating a new packaging technology called SoIC-mH in the upcoming ...

The M5 chip is expected to enter mass production in H1 2025. With the Apple M4 series chips already out on the latest Macs, ...

Key details about Apple's M5 chips, including production timelines, performance enhancements, and new design features ...

The surface mount SOIC version of this chip was slightly cheaper, and there’s always a way to make that work (Portuguese, Google Translation). How [Czar] did it is fairly impressive ...

Rumours have it that Apple's M5 chips may return to the more traditional format of separate CPU and GPU design. It's an ...

Unlike past SoCs, Apple is reportedly planning to separate the CPU and GPU in its upcoming M-series chips to take advantage ...

These chips will feature server-grade SoIC packaging and separate CPU and GPU designs, enhancing production yields and thermal performance. Apple's PCC infrastructure will expand post-production ...