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另辟蹊径:日本NIL与中国LDP,谁能撼动ASML EUV?
其次,由于现代逻辑芯片通常是多层结构,需要极高的纳米级层间对准精度,而在nil工艺中,由于是物理接触,如何确保每一层都与前一层精确对齐 ...
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