For 2025, Zhen Ding Tech chairman Charles Shen pointed out that four major product applications are expected to grow simultaneously, with the IC substrate business ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

For 2025, Zhen Ding Tech chairman Charles Shen pointed out that four major product applications are expected to grow simultaneously, with the IC substrate business showing the most significant growth.

DuPont de Nemours, Inc. DD has unveiled a comprehensive portfolio of cutting-edge circuit materials and solutions at the 2025 International Electronic Circuits Exhibition in Shanghai, designed to push ...

Onto Innovation and LPKF are set to accelerate mass production of glass core substrates for semiconductors LPKF joins Onto Innovation’s Packaging Applications Center of Excellence (PACE) Collaborating ...