AMD is now reportedly making all-American Ryzen 9000 CPU dies at TSMC's Arizona fab
Moreover, AMD Ryzen 9000 CPUs are chiplet designs. While it seems AMD is now having some 8-core CPU dies made in Arizona, the ...
Future Market Insights20 小时
Die Bonder Equipment Market Growth, Expected to Surpass USD 6,726.7 million by 2033, With a ...
The die bonder equipment market is estimated to be worth USD 4,415.3 million in 2023 and is set to surpass USD 6,726.7 ...
Engineering360 News6 年
4.7: Stacked Die and Package on Package
Die stacking is highly prevalent in memory packages and has been extended to logic and analog integrated circuits [35]. Some of the same advantages for SiP versus SoC are applicable for die stacking.
Semiconductor Engineering23 天
Achieving Successful Multi-Die Signoff
Static timing analysis (STA) in Synopsys PrimeTime relies on accurate parasitic extraction by Synopsys StarRC, handling all parts of the multi-die package, including through-silicon vias (TSVs), micro ...
electronics360.globalspec8 天
The next level of systems integration: Substrate-like PCBs
Fast forward to today, a new systems integration platform has emerged that fuses packaging with traditional approaches to PCB ...
Design-Reuse5 个月
UCIe Die-to-Die Chiplet Controller
Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...
Electronic Design1 个月
Automotive 3D ICs get a reliability boost from die-package thermal analysis
The semiconductor industry is turning to 3D ... Integration with package-system analysis: Integrated die-level and package-level thermal models allow for a continuous thermal analysis workflow ...
Design-Reuse26 天
Die-to-die phy IP Listing
Blue Cheetah is a leader in Die-to-Die (D2D) interconnect solutions for chiplets in very advanced and low-cost packaging applications. BlueLynx™ is a revolutionary D2D subsystem architecture ... The ...