And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

[Andrew Zonenberg] has crossed a line in his electronic hobby projects. The Ball Grid Array (BGA) is a type of chip footprint which most hobbyists leave to the professionals. But he’s learned ...

LG Innotek has begun the mass production of flip chip ball grid array (FC-BGA), its new semiconductor substrate targeting tech firms in the United States. “We have begun mass production of FC ...

LG Innotek, South Korea’s leading camera module maker, has started the mass production of flip-chip ball-grid array substrates ... The global FC-BGA market is expected to double from $8 billion ...