IT之家 3 月 15 日消息，消息源 @Jukanlosreve 昨日（3 月 14 日）在 X 平台发布推文，曝料称三星半导体代工业务陷入危机，由于 3nm（SF3）节点良率问题 ...

快科技3月21日消息，投资公司GF Securities在报告中称，iPhone 18系列搭载的A20芯片将会采用台积电第三代3nm工艺N3P制造，对此， 分析师Jeff Pu予以反驳 ...

has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate ...

报道称，消息人士透露，SK海力士已决定与台积电合作，最快明年3月就会发布一款采用台积电3nm制程生产的基础裸片（base die）的垂直堆叠HBM4原型 ...

此前，苹果于2023年9月率先推出3nm工艺A17 Pro芯片，随后联发科发布天玑9400，vivo X200系列成为首款搭载该芯片的安卓手机。而小米此番成功，预示着安 ...

has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced ...

In a research note with investment firm GF Securities today, analyst Jeff Pu said the A20 chip for the iPhone 18 models will be manufactured with TSMC's third-generation 3nm process, known as N3P.